Passive infrared sensor device

ABSTRACT

Systems and techniques are provided for sensor device. A sensor device may include a housing, a lens inserted into a first opening of the housing, a metal mask covering a portion of the interior of the lens, a passive infrared (PIR) sensor underneath the lens and the metal mask, and a light pipe around the PIR sensor, the lens, and the metal mask. Part of the light pipe may be positioned above an activation mechanism for a button. An airflow gasket may be around the PIR sensor. A filter circuit board may be under the PIR sensor and connected to leads of the PIR sensor. A control circuit board may include the activation mechanism for the button. A backplate may include a slot for attachment to a snap of a magazine in the housing of the sensor device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/983,631, filed Aug. 3, 2020, which is a continuation of U.S.application Ser. No. 15/876,824, filed Jan. 22, 2018, which are herebyincorporated by reference in their entirety for all purposes.

BACKGROUND

Sensor devices may include sensors inside of a housing. The housing mayalso include user interface elements to allow for control of the sensordevice. The type of sensors and user interface devices within and on ahousing for a sensor device may be limited by the size of the housing.Smaller housings may include fewer or smaller sensors, and fewer orsmaller user interface elements.

BRIEF SUMMARY

According to an implementation of the disclosed subject matter, anapparatus may include a housing, a lens inserted into a first opening ofthe housing, a metal mask covering a portion of the interior of thelens, a passive infrared (PIR) sensor underneath the lens and the metalmask, and a light pipe around the PIR sensor, the lens, and the metalmask. A portion of the light pipe may be positioned above an activationmechanism for a button.

The apparatus may include an airflow gasket around the PIR sensor. Theapparatus may include a filter circuit board under the PIR sensor andconnected to leads of the PIR sensor. The apparatus may include acontrol circuit board. The activation mechanism for the button may be onthe control circuit board.

The apparatus may include a sled inside the housing. The apparatus mayinclude a magazine inside the housing. Snaps may be formed as part ofthe magazine.

The housing may include a battery compartment. A retention partincluding a U-shaped structure, two prongs at the ends of the U-shapedstructure, and a tab at the bottom of the U-shaped structure, mayaccommodate the insertion of a battery that is inserted into the batterycompartment.

The housing may include a thinned portion. An ambient light sensor (ALS)may be located within the housing below the thinned portion of thehousing.

The light pipe may include a lens for a path light. An LED for a pathlight may be located within the housing below the light pipe.

The apparatus may include a tamper switch, including a cap, a frame, anda detect switch. The cap may be positioned to push down the detectswitch when pressed against a surface and release the detect switch whennot pressed against a surface. A temperature and humidity sensor may belocated within the housing beneath a second opening in the housing.

The apparatus may include a backplate. The backplate may include a slotfor attachment to a snap of a magazine located in the housing. Anadhesive strip may be attached to a back of the backplate and a pull tabof the adhesive strip may be pulled through a slot of the backplate tothe front of the backplate.

The backplate may include a slot and crush ribs for a bubble level. Thebubble level may be located in between crush ribs at the location of theslot.

The apparatus may include a corner backplate. The corner backplate mayinclude a slot for attachment to a snap of a magazine located in thehousing. An adhesive strip may be attached to a first plane of thecorner backplate. A second plane of the corner backplate may beperpendicular to the first plane of the corner backplate. A magazine andhousing may attach to the corner backplate in between the first planeand the second plane.

The apparatus may include a sleeve. The sleeve may cover the housing.The sleeve may include a screw hole.

An apparatus may include a sensor device. The sensor device may includea sensor device. The sensor device may include a housing including afirst opening at an angle at a first end of the housing and a secondopening on the body of the housing. The sensor device may include abutton assembly including a lens, a metal mask covering a portion of theinterior of the lens, a passive infrared (PIR) sensor underneath thelens and the metal mask, a light pipe around the PIR sensor, the lens,and the metal mask, where a portion of the light pipe positioned abovean activation mechanism for a button, and an airflow gasket around thePIR sensor. The lens and the light pipe may partially cover the firstopening of the housing. The sensor device may include a magazine locatedin the housing. The magazine may include two snaps protruding from themagazine through the second opening in the housing. A tamper switch maybe attached between the snaps of the magazine. The sensor device mayinclude a sled located in the magazine within the housing. An upper maincircuit board and a lower main circuit may be attached to the sled aboveand below a main body of the sled. A filter circuit board and controlcircuit board may be attached to an angled portion of the sled below thePIR sensor.

The apparatus may include a backplate. The backplate may include twoslots. The slots may accommodate the snaps of the magazine of the sensordevice to attach the sensor device to the backplate. The backplate maycover the second opening of the housing and presses the tamper switchwhen the sensor device is attached to the backplate.

An ambient light sensor (ALS) may be located below a thinned portion ofthe housing of the sensor device.

The sled may include knuckles. The light pipe may include end knuckles.The knuckles of the sled, the end knuckles of the light pipe, and a pin,may form a hinge.

An apparatus for a sensor device may include a temperature and humiditysensor. The temperature and humidity sensor may be connected to a sledbelow a filter circuit board. The apparatus may include a housing forthe sensor device.

The housing for the sensor device may include an opening which may bepermeable to the atmosphere outside of the housing. The temperature andhumidity sensor may be located near the opening.

An apparatus for a sensor device may include light emitting devices. Thelight emitting devices may be located within the sensor device.

One of the light emitting devices of the sensor device may be pathlight. The path light may be located between a housing of the sensordevice and a light pipe of the sensor device located within the housing.The light pipe may include a lens for the path light.

An apparatus for a sensor device may include snaps. The snaps may be anintegral component of a magazine of the sensor device. The sensor devicemay include two or more snaps. The magazine may be located within ahousing for the sensor device such that the snaps are exposed through anopening of the housing.

The snaps may be protrusions from the magazine that may extend beyondthe housing. Each snap may include a raised portion which may be thickerthan the remainder of the snap.

The snaps may fit into slots of a backplate for the sensor device. Thefit between the snaps and the slots of the backplate may be frictionfit. The snaps may hold the magazine onto the backplate when the snapsare inserted into the slots of the backplate. The magazine may beattached to the housing of the sensor device, which may be held onto thebackplate by the magazine and the snaps. The depth of the slots in thebackplate may be equal to or greater than the length of the snaps. Thesnaps may not protrude through the slots when the snaps are insertedinto the slots.

An apparatus for a sensor device may include a battery retentionmechanism. The battery retention mechanism may include a retention part.The retention part may have a U-shape, and may include two prongs andtab.

Each prong may be located on one end of the U-shape of the retentionpart, and may extend away from the U-shaped structure.

The tab may be located at the bottom of the U-shape of the retentionpart and may extend away from the U-shaped structure. The tab may extendaway from the U-shaped structure of the retention part in the oppositedirection of the two prongs.

The retention part may accommodate the insertion of a battery in theU-shaped structure between the two prongs.

The retention part may be inserted into a battery compartment of thesensor device with the tab inserted into a slot in the batterycompartment.

An apparatus for a sensor device may include a battery compartmentincluding battery connectors. The battery connectors may include a hatwhich may be positioned within the battery compartment to contact thepositive terminal of a battery inserted into the battery compartment.The hat may be connected to a spring which may be electrically connectedto a circuit board of the sensor device.

The battery connectors may include a coil spring which may be positionedwithin the battery compartment to contact the negative terminal of abattery inserted into the battery compartment. The coil spring may beconnected to a strip that includes conductive material. The strip thatincludes conductive material may connect to a spring at the opposite endof the strip from the coil spring. The spring may be electricallyconnected to the circuit board. The connection between the spring andthe main circuit board may include a screw which may secure the springto the circuit board.

An apparatus for a sensor device may include a tamper switch. The tamperswitch may include a detect switch, a frame, and a cap.

The detect switch may be located on a circuit board. The detect switchmay have an open position and closed position. The detect switch may gofrom the open position to the closed position when the detect switch ispushed in a threshold distance. The detect switch may be in the openposition when the detect switch has not been pushed in the thresholddistance.

The cap may be located over the detect switch. The cap may include aplunger located on the underside of the cap. The plunger may apply forceto the detect switch when the cap is pushed in. The cap may include aflexible material.

The frame may be placed around the cap when the cap is covering thedetect switch. The frame may hold the cap onto the circuit board. Theframe may include a rigid material. The frame may cover a portion of thecircuit board.

The tamper switch may be located in an opening of the housing of thesensor device. The tamper switch may be located such that placing thesensor device on a backplate pushes the cap in such that the plungercauses the detect switch to enter the closed position. The tamper switchmay be located such that removing the sensor device from a backplatecauses the detect switch to enter the open position.

The position of the tamper switch may indicate whether the sensor deviceis attached to a backplate. The sensor device may determine that thesensor device is not attached to the backplate when the tamper switch isin the open position.

A backplate for a sensor device may include a slot and an adhesive stripthat may include adhesive stretch and release material and a pull tab.The adhesive strip may be attached to the back of the backplate suchthat the adhesive stretch and release material is exposed. The backplatemay be attached to a surface using the exposed adhesive stretch andrelease material.

The pull tab may be pulled through the slot such that the pull tab isaccessible on the opposite side of the backplate from the adhesivestretch and release material. Pulling the pull tab may release theadhesive stretch and release material. Attaching a sensor device to thebackplate may cover the pull tab.

A backplate for a sensor device may include a bubble level. Thebackplate may include crush ribs which may hold the bubble level. Thebackplate may include a slot through which the bubble level may beinserted into the crush ribs of the backplate. The backplate may includea liner which may cover the slot through which the bubble has beeninserted. Attaching a sensor device to the backplate may cover thebubble level.

An apparatus for a sensor device may include an ambient light sensor anda housing including walls. The ambient light sensor may be locatedwithin the housing proximate to a portion of a wall of the housing maybe thinned such that ambient light may reach the ambient light sensorthrough the portion of the wall of the housing that has been thinned.

The portion of the wall of the housing may thinned by removing materialfrom the interior of the wall of the housing. A CNC machine tool may beused to thin the portion of the wall of the housing. The housing may bemade of polycarbonate.

A corner backplate for a sensor device may be prism shaped. A firstplane of the prism of the corner backplate may be open to accommodatethe insertion of a sensor device. A second plane of the prism of thecorner backplate may include adhesive strip with exposed material toattach the corner backplate to a surface when the sensor device isinserted into the corner backplate at the first plane. A third plane ofthe prism of the corner backplate may be at an angle to the first planeand the second plane such that when the corner backplate is attached toa surface the third plane is at a 45-degree angle to the surface.

The second plane and the third plane of the prism of the cornerbackplate may include slots. The slots may accommodate snaps of thesensor device. The snaps of the sensor device may attach the sensordevice to corner backplate at the slots when the sensor device isinserted into the opening of the first plane of the prism of the cornerbackplate.

An apparatus for a sensor device may include a sleeve that may cover thesensor device. The sleeve may cover a sensor device that is attached tobackplate which is attached to a surface such that only a portion of thefront of the sensor device may be visible at an opening of a front sideof the sleeve. A backside of the sleeve may be open to allow the sleeveto be inserted over the sensor and the backplate while the backplate isattached to a surface. The sleeve may include a screw hole which mayaccommodate a screw. The screw hole may be against or proximate to asurface when the sleeve covers a sensor device that is attached to abackplate that is attached to the surface. The screw may attach thesleeve to the surface through the screw hole. A sleeve covering a sensordevice and a backplate and attached to surface with a screw may not beremoved from the sensor device and the backplate without removal of thescrew.

Additional features, advantages, and implementations of the disclosedsubject matter may be set forth or apparent from consideration of thefollowing detailed description, drawings, and claims. Moreover, it is tobe understood that both the foregoing summary and the following detaileddescription provide examples of implementations and are intended toprovide further explanation without limiting the scope of the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosed subject matter, are incorporated in andconstitute a part of this specification. The drawings also illustrateimplementations of the disclosed subject matter and together with thedetailed description serve to explain the principles of implementationsof the disclosed subject matter. No attempt is made to show structuraldetails in more detail than may be necessary for a fundamentalunderstanding of the disclosed subject matter and various ways in whichit may be practiced.

FIG. 1A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 1B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 1C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 2A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 2B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 2C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 3A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 3B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 3C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 4A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 4B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 5 shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 6A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 6B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 6C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 6D shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 6E shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 7A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 7B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 7C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 7D shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 8A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 8B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 9A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 9B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 10A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 10B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 10C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 10D shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 11A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 11B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter.

FIG. 12 shows an example sensor as disclosed herein.

FIG. 13 shows an example of a sensor network as disclosed herein.

FIG. 14 shows an example configuration of sensors, one or morecontrollers, and a remote system as disclosed herein.

FIG. 15 shows a computer according to an embodiment of the disclosedsubject matter.

FIG. 16 shows a network configuration according to an embodiment of thedisclosed subject matter.

DETAILED DESCRIPTION

Sensor devices as disclosed herein may have a variety of uses, forexample within a smart home, premises monitoring or security systems, orsimilar environments. As disclosed in further detail herein, one or moresensors, user interface elements, and other components may be integratedwithin a sensor device, such as within and/or on the surface of ahousing of the sensor device.

A sensor device may include one or more sensors, including a passiveinfrared sensor (PIR), an ambient light sensor (ALS), and a temperatureand humidity sensor, for example as shown in FIGS. 1A-1C and asdescribed in further detail below. The sensor device may also include atactile switch or button, which may be integrated with the PIR, forexample as shown in FIGS. 1A-1C and as described in further detailbelow. The PIR may include a metal mask which may partially cover theinside of the lens of the PIR. The PIR may be attached to both a circuitboard under the PIR sensor and to a main circuit board, for example asshown in FIGS. 1A-1C and as described in further detail below. Thesensor device may also include one or more light emitting devices, suchas light emitting diodes (LEDs), which may be arranged on and/or withinthe sensor device so that their emitted light is visible outside of ahousing of the sensor device, for example as shown in FIGS. 2A-2C and asdescribed in further detail below. A LED may act as a path light, forexample in a smart home or similar environment. The sensor device mayinclude snaps which may be used to attach the housing of the sensordevice to a backplate, for example as shown in FIGS. 3A-3C and asdescribed in further detail below. The battery compartment of thehousing of the sensor device may include a battery retention mechanism,for example as shown in FIGS. 4A-4B and as described in further detailbelow. The battery compartment may also include battery connectors thatmay allow for the connection between the battery and the components ofthe sensor device to be contained in a smaller space, for example asshown in FIG. 5 and as described in further detail below. The housing ofthe sensor device may include a tamper switch which may operate inconjunction with the backplate, for example as shown in FIGS. 6A-6E andas described in further detail below. The backplate may include anadhesive strip with a pull tab that may not be visible when the housingof the sensor device is attached to the backplate, for example as shownin FIGS. 7A-7D and as described in further detail below. The backplatemay include a bubble level, for example as shown in FIGS. 8A-8B and asdescribed in further detail below. The ALS may be positioned within thehousing of the sensor device at a location where the wall of the housinghas been thinned, for example as shown in FIGS. 9A-9B and as describedin further detail below. A corner backplate may allow the sensor deviceto be installed in the corner of a room, for example as shown in FIGS.10A-10C and as described in further detail below. A sleeve may be usedto cover the sensor device, for example as shown in FIGS. 11A-11B and asdescribed in further detail below.

The PIR of the sensor device may be integrated with the tactile switchor button of the sensor device. The lens of the PIR may serve as acontact point for a person to push to use the button or tactile switchof the sensor device. The PIR may be located underneath the lens. Thelens may be in contact with a light pipe which may also serve as a lightguide for an LED. The light pipe may be in contact with an airflowgasket, which may have cutouts to accommodate the light pipe. The lightpipe may include metal hinges. The light pipe may be hollow-shaped, forexample, ring shaped, and the airflow gasket may include a cutout at itscenter to allow for a line-of-sight from the PIR to the lens. Theairflow gasket may be positioned to fill space around the PIR that isnot filled by the light pipe, lens, or a metal mask which may bepartially within the lens. The airflow gasket may prevent hot air fromentering the sensor device to avoid false positive readings from thePIR.

The PIR may be attached to a filter circuit board which may performfiltering functions for the PIR. The filter circuit board may be anysuitable printed circuit board of any suitable size and shape. Thefilter circuit board may be, for example, 0.5 mm thick. Leads of the PIRmay be connected to the filter circuit board. A grounding adhesive maybe placed in between the PIR and the filter circuit board. The filtercircuit board may be accommodated in a cutout in a control circuit boardthat may include the activation mechanism of the button or tactileswitch. When a user pushes down on the lens, this may push the lightpipe downwards, and a part of the light pipe may push down on theactivation mechanism of the button or tactile switch. This may allow thelens and PIR to be part of the button or tactile switch of the sensordevice, as pushing down on the lens of the PIR may cause the light pipeto activate the activation mechanism of the button or tactile switch.

The PIR may include a metal mask which may partially cover the inside ofthe lens of the PIR. The metal mask may be located underneath the lens,and may cover, for example, half of the lens. The metal mask may haveany suitable shape. The metal mask may be contained within the lens andthe light pipe. The metal mask may, for example, provide rigidity to thelens, which may be made of a soft material. The metal mask may cause thePIR to not detect the movement of certain heat sources, for example,heat sources that may be low to the ground in a room, such as animals.

Leads of the PIR may be connected to the filter circuit board, and maypass through the filter circuit board to be connected directly to a maincircuit board of the sensor device. The lens, light pipe, PIR, filtercircuit board, and control circuit board may be arranged at an angle tothe main circuit board. A sled, which may be, for example, plastic, mayhold the control circuit board at angle, and may include holes which mayallow the leads of the PIR to pass through and connect to the maincircuit board. The main circuit board may include two pieces, such as anupper main circuit board which may be located above the base of thesled, and a lower main circuit board which may be located below the baseof the sled. The leads of the PIR may connect to the lower main circuitboard.

The temperature and humidity sensor may be connected to the sled belowthe filter circuit board on the angled portion of the sled. The housingof the sensor device may include an opening which may be permeable toatmosphere outside of the housing. The temperature and humidity sensormay be positioned near the opening so that it may detect the temperatureand humidity of the environment outside of the housing of the sensordevice.

The sensor device may also include one or more light emitting devices,such as light emitting diodes (LEDs), which may be arranged on andwithin the sensor device so that their emitted light is visible outsideof a housing of the sensor device. A LED may act as a path light. Thepath light LED may be mounted in the sensor device in between thehousing of the sensor device and the portion of the light pipe insertedinto the sensor device. A lens for the path light may be attached to alens holder formed on the light pipe, allowing light from the path lightLED to exit the housing of the sensor device. The lens holder may beformed such that light from the path light LED is angled downwardstoward the floor when the sensor device is mounted to a wall.

The sensor device may include snaps which may be used to attach thehousing of the sensor device to a backplate. A magazine within thehousing of the sensor device may hold the various components of thesensor device, such as, for example, the sled with attached circuitboards including the main circuit board, control circuit board, andfilter circuit board. The magazine may be any suitable shape, such as,for example, a tube with one angled end. Snaps may be an integralcomponent of the magazine. The snaps may be, for example, shortprotrusions or fins of any suitable shape, which may include a raisedportion. The magazine may include any suitable number of snaps, such as,for example, two snaps. The snaps may be arranged in any suitablemanner.

The snaps of the magazine may be used to attach the sensor device to abackplate. The backplate may include one or more slots which may alignwith the snaps of the magazine. Before or after the backplate isattached to a wall, the sensor device may be attached to the backplateby aligning the snaps of the magazine with the slots of the backplateand pushing the sensor device onto the backplate. The snaps, onceinserted into the slots of the backplate, may hold the sensor device onto the backplate, for example, through friction fitting. The snaps ofthe magazine may not protrude through the slots of the backplate, andmay be inserted into the slots to any suitable depth based on the depthof the slots and the size of the snaps. The backplate may close thehousing of the sensor device, covering the magazine and the battery. Thesnaps may also be used to attach the sensor device to a cornerbackplate.

The battery compartment of the housing of the sensor device may includea battery retention mechanism. The battery retention mechanism mayinclude a retention part. The retention part may have any suitableshape, and be made of any suitable material. For example, the retentionpart may include a U-shaped structure made of plastic. The retentionpart may include prongs at each of the U-shaped structure. The prongsmay protrude away from the U-shaped structure. The retention part mayalso include a tab at the bottom of the curve of the U-shaped structure.The tab may protrude away from the U-shaped structure in the oppositedirection from the prongs. A battery may be inserted into the retentionpart, with the retention part towards the positive terminal of thebattery. There may be a small gap between the prongs of the retentionpart and the body of the battery. The retention part, with the battery,may be inserted into the housing of the sensor device. The tab of theretention part may be inserted into a slot in the housing of the sensordevice. The retention part may assist in holding the battery in placewithin the housing when the sensor device is jostled.

The battery compartment may also include battery connectors that mayallow for the connection between the battery and the components of thesensor device to be contained in a smaller space. The positive terminalof the battery may be in contact with a hat, which may be made of aconductive material and may serve as an electrical contact for thepositive terminal of the battery. The hat may be connected to a positivespring which may connect to the main circuit board of the sensor devicethrough a cutout in a back piece of the sled. The negative terminal ofthe battery may be in contact with a coil spring which may be made of aconductive material. A strip of conductive material may be connected tothe coil spring, and may traverse the length of the battery and connectto a negative spring. The negative spring may be connected to the maincircuit board through a cutout in side of the magazine. A screw may beused to hold the negative spring on the main circuit board at anelectrical contact of the main circuit board.

The housing of the sensor device may include a tamper switch which mayoperate in conjunction with the backplate. The tamper switch may includea detect switch on the lower main circuit board, a frame, and a cap. Thecap may be made of a suitable flexible material, such as silicone. Thecap may cover the detect switch on the lower main circuit board suchthat pushing down on the cap may activate the detect switch. Forexample, the underside of the cap may include a plunger, which may bematerial that extends down on the underside of the cap. The plunger mayhover above, be just in contact with, or push down on but not close thedetect switch when the cap is not pushed down, and may push down on thedetect switch when the cap is pushed down. The detect switch may defaultto an open position, in which it is not pushed down far enough to beclosed, when no force is holding the detect switch down, or the detectswitch is not pushed down far enough. The frame may be made of anysuitable material, which may be more rigid than the material of the cap,and may hold the cap in place on the lower main circuit board whilecovering otherwise exposed portions of the lower main circuit board.

The tamper switch may be located in any suitable location on the sensordevice. For example, the lower main circuit board may be located at thetop of the magazine, between the snaps. The cap, when not pushed down,may rise above the magazine between the snaps. When the sensor devicehas not been attached to a backplate, the cap of the tamper switch maybe visible on back of the sensor device. The detect switch may be in anopen position. When the sensor device is attached to a backplate, forexample, using the snaps, the cap may be pushed down by the backplateand may in turn push down the detect switch, resulting in the detectswitch being in a closed position. The tamper switch may allow for thedetermination of whether the sensor device is attached to a backplate.For example, the detect switch of the tamper switch of a sensor devicethat is attached to a backplate will be in the closed position. If thesensor device is removed from the backplate, for example, falling off orbeing purposely removed, the detect switch may open, as the plunger ofthe cap may no longer pushing down the detect switch far enough to closeit, allowing the detect switch to return to the open position.

The backplate may include an adhesive strip with a pull tab that may notbe visible when the housing of the sensor device is attached to thebackplate. The backplate may include an adhesive strip on its back. Theadhesive strip may be used to attach the backplate to surfaces, such asa wall. The adhesive strip may be made using an adhesive stretch andrelease material. A pull tab used to release the adhesive strip may befed through a slot in the backplate, so that that the pull tab isvisible on the other side of the backplate from the adhesive strip. Thepull tab may thus be visible when the backplate is attached to a wallbut no sensor device is attached to the backplate. Attaching a sensordevice to the backplate may cover the pull tab so that it is not visibleor accessible to pull. The sensor device may need to be removed from thebackplate before the pull tab can be accessed to be pulled, releasingthe adhesive strip on the backplate from the wall and allowing thebackplate to be removed from the wall.

The backplate may include a bubble level. The backplate may include aslot through which the bubble level may be inserted. The bubble levelmay be held in place with crush ribs. Crush ribs may be thin ribs whichmay be designed to deform when the bubble level is pressed into them,allowing for a press fit of the bubble level into the crush ribs. Thebubble level may be visible when the sensor device is not attached tothe backplate, and may be covered when the sensor device is attached tothe backplate. A liner may be placed over the bubble level on the backof the backplate. The liner may adhere to the backplate in between thebubble level and the adhesive strip.

The ALS may be positioned within the housing of the sensor device at alocation where the wall of the housing has been thinned. The housing maybe made of a material that may be permissive to light transmission oflight in the visible spectrum, such as, for example, polycarbonate. Aportion of the wall of the housing of the sensor device may be thinned,for example, using a CNC machine tool. The thinned portion of thehousing may be at any suitable location on the housing that will not bepointed towards a wall when the sensor device is mounted to a backplate.For example, the thinned portion may be located near the lens for thePIR. The thinned portion of the housing may be formed by, for example, ahole in the housing that starts on the interior of the housing and stopsbefore going through exterior of the housing. The thinned portion of thehousing may be thin enough to allow light to pass through the materialof the housing. The ALS may be placed below the thinned portion of thehousing so that it may receive ambient light that passes through thethinned portion of the housing. A hole used to create a thinned portionof the housing may have a diameter of, for example, 2 mm, and thethinned portion of the housing may be 0.3 mm thick. The distance fromthe bottom of the thinned portion of the housing to the ALS may be, forexample, 1.45 mm.

A corner backplate may allow the sensor device to be installed in thecorner of a room. The corner backplate may be a backplate that, whenattached to a wall near a corner, allows an attached sensor device toface out from the corner. The corner backplate may also be used to causethe sensor device to face out at an angle when attached to a wall awayfrom a corner. The corner backplate may include slots to accommodate thesnaps of the magazine. The corner backplate may be prism shaped. Theslots for the snaps may be located on adjacent planes of the prism. Anadhesive strip may be located on one the adjacent planes with the slots,to attach the corner backplate to a wall. The other adjacent plane withthe slots may include a separate cover piece which may be used to coverthe slots once the sensor device is inserted, so that the snaps of themagazine are not exposed. The remaining plane of the prism may be opento accommodate the insertion of the sensor device.

A sleeve may be used to cover the sensor device. The sleeve may be, forexample, a plastic cover with an angled opened which may accommodate thehousing of the sensor device and a backplate or corner backplate. Whenthe sleeve is placed over the sensor device the lens of the PIR sensormay be visible at the angled opening of the sleeve. The sleeve mayinclude a screw hole, located in any suitable position, which may beused to allow a screw to attach the sleeve to a wall. A spacer may beused behind the screw hole when the sleeve is used with a cornerbackplate. When the sleeve is used to cover a sensor device, the sleevemay not be removable, and only the lens of the sensor device may bevisible, until the screw has been removed from the wall.

Specific examples of devices according to the present disclosure willnow be described in further detail with reference to the variousdrawings. It will be understood that, unless explicitly described to thecontrary, the various features illustrated and described may be used inany combination other than the specific combinations shown and describedto the extent possible based on the specific physical dimensions andarrangements of the individual features and components.

FIG. 1A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. A buttonassembly 100 for a sensor device may include a lens 110, a metal mask130, a PIR sensor 140, a filter circuit board 150, a light pipe 160, andan airflow gasket 170. The button assembly may be contained within anopening of a housing 120 of the sensor device. The lens 110 for the PIRsensor 140 may serve as a contact point for a person to push in order touse the button or tactile switch of the sensor device. The lens 110 maybe in contact with the light pipe 160. The light pipe 160 may be a ringand may include an outer portion 163 and an inner portion 165. The lightpipe 160 may be in turn be in contact with the airflow gasket 170, whichmay have cutouts to accommodate the light pipe 160. The light pipe 160may include metal hinges. The PIR sensor 140 may be located underneaththe lens 110. The airflow gasket 170 may include a cutout at its centerto allow for a line-of-sight from the PIR sensor 140 to the lens 110.The airflow gasket 170 may be positioned to fill space within thehousing 120 around the PIR sensor 140 that is not filled by the lightpipe 160, the lens 110, or the metal mask 130. The airflow gasket 170may prevent hot air from entering the sensor device to avoid falsepositive readings from the PIR sensor 140.

The PIR sensor 140 may be attached directly to the filter circuit board150 which may perform filtering functions for the PIR sensor 140. Thefilter circuit board 150 may be any suitable printed circuit board ofany suitable size and shape. The filter circuit board 150 may be, forexample, 0.5 mm thick. The filter circuit board 150 may rest on a sled190, and be accommodated in a cutout in a control circuit board 180 thatmay include the activation mechanism of the button or tactile switch.When a user pushes down on the lens 110, this may push the light pipedownwards 160, and a part of the light pipe 160 may push down on theactivation mechanism of the button or tactile switch. This may allow thelens 110 and the PIR sensor 140 to be part of the button or tactileswitch of the sensor device.

FIG. 1B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. A buttonor tactile switch 185 may be located on the control circuit board 180,underneath the light pipe 160. Pushing down on the light pipe 160, forexample, through pressure on lens 110, may push down on the button ortactile switch 185, allowing it to be activated. This may allow a userto interact with a user interface of the sensor device through pushingdown on the lens 110 of the PIR sensor 140.

FIG. 1C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Themetal mask 130 may partially cover the inside of the lens of the PIR110. The metal mask 130 may be located underneath the lens 110, and maycover, for example, half of the lens 110. The metal mask 130 may haveany suitable shape. The metal mask 130 may be located within the lightpipe 160 along with the part of the lens 110 that surrounds the metalmask 130. The metal mask 130 may, for example, provide rigidity to thelens 110, which may be made of a soft material. The metal mask 130 maycause the PIR sensor 140 to not detect the movement of certain heatsources, for example, heat sources that may be low to the ground in aroom, such as animals.

The light pipe 160 may include hinge piece 165. The hinge piece 165 maybe, for example, the end knuckles for a hinge formed by the light pipe160 and the sled 190. The sled 190 may include middle knuckles 192. Apin 191 may join the hinge piece 165 and the middle knuckles 192, andmay hold the light pipe 160 to the sled 190 while allowing the lightpipe 160 a range of motion. When the lens 110 is pushed, the light pipe160 may be pushed down while rotating around the pin 191. This may allowthe portion of the light pipe 160 opposite the hinge piece 165 to bepushed down onto the activation mechanism of the button or tactileswitch 185.

Leads of the PIR sensor 140 may be connected to the filter circuit board150, and may pass through the filter circuit board 150 to be connecteddirectly to a lower main circuit board 193 of the sensor device. Thelens 110, the light pipe 160, the PIR sensor 140, the filter circuitboard 150, and the control circuit board 180 may be arranged at an angleto the lower main circuit board 193. The sled 190 may hold the controlcircuit board 180 at angle, and may include holes which may allow theleads of the PIR sensor 140 to pass through and connect to the lowermain circuit board 193. An upper main circuit board 195 may be attachedto the sled 190, for example, above the lower main circuit board 193. Ashielding 197 may be placed over the upper main circuit board 195. Atemperature and humidity sensor 199 may be attached to the sled on anend of the portion of the sled 190 that holds the filter circuit board150 and the control circuit board 180 at an angle.

FIG. 2A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thesensor device may also include one or more light emitting devices, suchas light emitting diodes (LEDs), which may be arranged on and within thesensor device so that their emitted light is visible outside of thehousing 120 of the sensor device. An LED 200 may act as a path light.The path light LED 200 may be mounted in the sensor device in betweenthe housing 120 of the sensor device and the portion light pipe 160inserted into the housing 120. A lens for the path light 200 may beattached to a lens holder 210 formed on the light pipe 160, allowinglight from the path light LED 200 to exit the housing 120 of the sensordevice. An opening 250 may be located near the path light LED 200. Theopening 250 may allow the outside atmosphere to reach the temperatureand humidity sensor 199.

FIG. 2B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thelight pipe 160 may include the lens holder 210, which may hold a lensfor the path light LED 200.

FIG. 2C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. The lensholder 210 may be formed such that light from the path light LED 200 isangled downwards toward the floor when the sensor device is mounted to awall of a room. The lens holder 210 may be located, for example, belowthe lens 110 of the PIR sensor 140. The visible portions of the lightpipe 160 around the lens 110 may serve as a light pipe or light guidefor other LEDs of the sensor device.

FIG. 3A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thesensor device may include snaps 310 which may be used to attach thehousing 120 of the sensor device to a backplate 350. A magazine 300within the housing 120 of the sensor device may hold the variouscomponents of the sensor device, such as, for example, the sled 190 withattached circuit boards including the upper main circuit board 195 andlower main circuit board 193, control circuit board 180, and filtercircuit board 150. The backplate 350 may include slots 355, which may beany suitable size and shape to accommodate the snaps 310 such that thesnaps 310 are held in place when inserted into the slots 355. The snaps310 may include raised portions 315.

FIG. 3B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Themagazine 300 may be any suitable shape, such as, for example, a tubewith one angled end. The snaps 310 may be an integral component of themagazine 300. The snaps 310 may be, for example, short protrusions orfins of any suitable shape formed on the magazine 300. The magazine 300may include any suitable number of the snaps 310, such as, for example,two of the snaps 310. The snaps 310 may be arranged on the magazine 300in any suitable manner and location.

FIG. 3C shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thesnaps 310 of the magazine 300 may be used to attach the sensor device tothe backplate 350. Before or after the backplate 350 is attached to awall, the sensor device may be attached to the backplate 350 by aligningthe snaps 310 of the magazine with the slots 355 of the backplate 350and pushing the sensor device onto the backplate 350. The snaps 310,once inserted into the slots 355 of the backplate 350, may hold thesensor device to the backplate 350, for example, through frictionfitting between the snaps 310 and the slots 355. The snaps 310 of themagazine 300 may not protrude through the slots 355 of the backplate350, and may be inserted into the slots 355 to any suitable depth basedon the depth of the slots 355 and the size of the snaps 310. Thebackplate 350 may close the housing 120 of the sensor device, coveringthe magazine 300 and a battery of the sensor device. The snaps 310 mayalso be used to attach the sensor device to a corner backplate.

FIG. 4A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thehousing 120 of the sensor device may include a battery compartment 450for a battery 460. The battery compartment may include may include abattery retention mechanism. The battery retention mechanism may includea retention part 400, which may, for example, include a U-shapedstructure 407 made of any suitable material, such as plastic. TheU-shaped structure 407 may include prongs 403 at each end of theU-shaped structure 407 which may protrude away from the U-shapedstructure 407, and a tab 405 at the bottom of the curve of the U-shapedstructure 407 which may protrude away from the U-shaped structure 407 inthe opposite direction from the prongs 403. The retention part 400 mayhave a different shaped structure, for example, if the battery 460 isrectangular rather than cylindrical.

FIG. 4B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thebattery 460 may be inserted into the retention part 400 towards thepositive terminal of the battery 460 with the prongs 403 of theretention part separated from the body of the battery 460 by a smallgap. The retention part 400 may be inserted into the housing 120 of thesensor device, into the battery compartment 450, along with the battery460. The tab 405 of the retention part 400 may be inserted into a slotin the housing 120 of the sensor device. The retention part 400 may holdthe battery 460 in place within the housing 120 when the sensor deviceis jostled.

FIG. 5 shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thebattery compartment 450 may also include battery connectors that mayallow for the connection between the battery 460 and the rest of thesensor device in a small space. The positive terminal of the battery 460may be in contact with a hat 470, which may be made of a conductivematerial, and may serve as an electrical contact for the positiveterminal of the battery 460. The hat 470 may be connected to a positivespring 510, which may connect to the upper main circuit board 195 of thesensor device through a cutout in a back piece of the sled 190. Thenegative terminal of the battery 460 may be in contact with a coilspring 520, which may be made of a conductive material. A strip 530 ofconductive material may be connected to the coil spring 520, and maytraverse the length of the battery 460 and connect to a negative spring540. The negative spring 540 may be connected to upper main circuitboard 195 through a cutout in side of the magazine 300. Screw 550 may beused to secure the negative spring 540 to a negative contact 560 on theupper main circuit board 195.

FIG. 6A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thehousing 120 of the sensor device may include a tamper switch 600 whichmay operate in conjunction with the backplate 350. The tamper switch 600may include a detect switch 635 on a lower main circuit board 193, aframe 610, and a cap 620. The cap 620 may be made of a suitable flexiblematerial, such as silicone, and may cover the detect switch 635 on thelower main circuit board 193 such that pushing down on the cap 620 mayactivate the detect switch 630. The frame 610 may be made of anysuitable material, which may be more rigid than the material of the cap620, and may hold the cap 620 in place on the lower main circuit board193 while covering otherwise exposed portions of the lower main circuitboard 193.

FIGS. 6B and 6C show example arrangements suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thetamper switch 600 may be located in any suitable location on the back ofthe housing 120 of the sensor device. For example, the lower maincircuit board 193 may be located at the top of the magazine 300, betweenthe snaps 310. The frame 610 and the cap 620 may cover the lower maincircuit board 193 in between the snaps 310.

FIG. 6D shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Theunderside of the cap 620 may include a plunger 625, which may bematerial that extends down on the underside of the cap 620. The plunger625 may be above, be just in contact with, or push down on but notclose, the detect switch 635 when the cap 620 is not pushed down, andmay push down on the detect switch 635 when the cap 620 is pushed down.The detect switch 635 may default to an open position, in which it isnot pushed down far enough to be closed, when no force is holding thedetect switch 635 down, or the detect switch 635 is not pushed down farenough. For example, the backplate 350 may be attached to a wall 680 butthe sensor device may not be attached to the backplate 350. This mayallow the detect switch 635 to remain in an open position, as no forcemay be pushing the cap 620 down towards the detect switch 635. When thesensor device has not been attached to the backplate 350, the cap 620 ofthe tamper switch 600 may be visible on back of the sensor device.

FIG. 6E shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. When thesensor device is attached to the backplate 350, for example, using thesnaps 310, the cap 620 may be pushed down by the backplate 350 and mayin turn push down the detect switch 635 through the plunger 625,resulting in the detect switch 635 being in a closed position. Thetamper switch 600 may allow for the determination of whether the sensordevice is attached to the backplate 350. For example, the detect switch635 of the tamper switch 600 of a sensor device that is attached to thebackplate 350 will be in the closed positioned. If the sensor device isremoved from the backplate 350, for example, falling off or beingpurposely removed, the detect switch 635 may open, as the plunger 625 ofthe cap 620 may no longer be pushing down on the detect switch 635allowing the detect switch 635 to return to the open position.

FIG. 7A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thebackplate 350 may include an adhesive strip 700 with a pull tab 720 thatmay not be visible when the housing 120 of the sensor device is attachedto the backplate 350. The adhesive strip 700 may be made using anadhesive stretch and release material, which may make up the adhesivestrip body 710 and may be released from adhesion using the pull tab 720.The adhesive strip 700 may be used to attach the backplate 350 tosurfaces, such as a wall.

FIG. 7B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thebackplate 350 may include a slot 730, which may be located in anysuitable location on the backplate 350. The slot 730 may allow theadhesives strip body 710 to be adhered to the back of the backplate 350while the pull tab 720 may be reachable on the front of the backplate350.

FIGS. 7C and 7D show example arrangements suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. The pulltab 720 may be fed through the slot 730 in the backplate 350 so thatthat the pull tab 720 may be visible on other side of the backplate 350from the adhesive strip body 710. The pull tab 720 may thus be visiblewhen the backplate 350 is attached to a wall but no sensor device isattached to the backplate 350. Attaching a sensor device to thebackplate 350, for example, using the slots 355, may cover the pull tab720 so that it is not visible or accessible to pull. The sensor devicemay need to be removed from the backplate 350 before the pull tab 720can be accessed to be pulled, releasing the adhesive strip 700 on thebackplate from the wall and allowing the backplate 350 to be removedfrom the wall.

FIGS. 8A and 8B show example arrangements suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thebackplate 350 may include a bubble level 810. The backplate 350 mayinclude a slot 840 through which the bubble level 810 may be inserted.The bubble level 810 may be held in place with crush ribs 820. Thebubble level 810 may be visible when the sensor device is not attachedto the backplate 350, and may be covered when the sensor device isattached to the backplate 350. A liner 840 may be placed over the bubblelevel 810 on the back of the backplate 350. The liner 850 may be inbetween the bubble level 810 and the adhesive strip 700, for example, toprevent the adhesive strip 700 from adhering to the bubble level 810.The liner 850 may be adhesive so that it may adhere to the backplate350.

FIGS. 9A and 9B show example arrangements suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. An ALS910 may be positioned within the housing 120 of the sensor device at alocation where the wall of the housing 120 has been thinned. A portionof the wall of the housing 120 of the sensor device may be thinned, forexample, using a CNC machine tool. A thinned portion 900 of the housing120 may be at any suitable location on the housing that will not bepointed towards a wall when the sensor device is mounted to a backplatesuch as the backplate 350. For example, the thinned portion 900 may belocated near the lens 110 for the PIR sensor 140. The thinned portion900 of the housing 120 may be formed by, for example, a hole in thehousing 120 that starts on the interior of the housing 120 and stopsbefore going through exterior of the housing 120. The thinned portion900 of the housing 120 may be thin enough to allow light to pass throughthe material of the housing 120. The ALS 910 may be placed below thethinned portion 900 so that the ALS 910 may receive ambient light thatpasses through the thinned portion 900 of the housing 120. A lightblocking gasket 920 may be positioned to prevent light from LEDs on theinterior of the sensor device from reaching the ALS 910. The thinnedportion 900 of the housing 120 may be formed by a hole which may have adiameter of, for example, 2 mm, and the thinned portion 900 of thehousing may be 0.3 mm thick. The distance from the bottom of the thinnedportion 900 of the housing to the ALS 910 may be, for example, 1.45 mm.

FIGS. 10A-C show example arrangements suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. A cornerbackplate 1000 may allow the sensor device to be installed in the cornerof a room. The corner backplate 1000, when attached to a wall near acorner, may allow an attached sensor device to face out from the corner.The corner backplate 1000 may also be used to cause the sensor device toface out at an angle when attached to a wall away from a corner. Thecorner backplate 1000 may include the slots 355 to accommodate the snaps310 of the magazine 300. The corner backplate 1000 may be prism shaped.The slots 355 for the snaps 310 may be located on adjacent planes of theprism. An adhesive strip 1020 may be located on one of the adjacentplanes with the slots 355, to attach the corner backplate 1000 to awall. The other adjacent plane with the slots 355 may include a separatecover piece 1010 which may be used to cover the slots 355 once thesensor device is inserted, so that the snaps 310 of the magazine 300 arenot exposed. The remaining plane of the prism may be open to accommodatethe insertion of the sensor device.

FIG. 10D shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. Thecorner backplate 1000 may be used to attach the sensor device to thewall 680 at a corner. The adhesive strip 1020 may be used to attach thecorner backplate 1000, with inserted sensor device, to the wall 680 justbefore the corner. This may result in the plane of the corner backplate1000 with the adhesive strip 1020 being parallel to the wall 680, whilethe plane of the corner backplate 1000 with the cover piece 1010 may beparallel to the wall 1080 that forms a corner where it meets the wall680.

FIG. 11A shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. A sleeve1100 may be used to cover the sensor device. The sleeve 1100 may be, forexample, a plastic cover with an angled opened which may accommodate thehousing 120 of the sensor device and a backplate 350 or corner backplate1000. The sleeve 1100 may include a screw hole 1105, located in anysuitable position, which may be used to allow a screw 1110 to attach thesleeve 1100 to a wall. An adhesive screw cover 1120 may be used to coverthe screw hole 1105 after the screw 1110 is inserted. A spacer 1130 maybe used when the sleeve 1100 is used to with the corner backplate 1000to prevent the screw 1110 from being exposed due to the back of thescrew hole 1105 not being flush against a wall.

FIG. 11B shows an example arrangement suitable for a sensor deviceaccording to an implementation of the disclosed subject matter. When thesleeve 1100 is placed over the sensor device the lens 110 of the PIRsensor 140 may be visible at the angled opening of the sleeve 1100. Thesleeve 1100 may also include an opening 1115 at the location of the ALS910 to allow light to pass through to the ALS 910. The screw 1110 may beused to attach the sleeve 1100 to the wall 680. The sleeve 1110 maycover the housing 120 of the sensor device and the backplate 350, whichmay not be accessible without removing the sleeve 1100. Removing thesleeve 110 may first require removing the screw 1110 from the wall 680.

Implementations disclosed herein may use one or more sensors. Ingeneral, a “sensor” may refer to any device that can obtain informationabout its environment. Sensors may be described in terms of the type ofinformation they collect. For example, sensor types as disclosed hereinmay include motion, smoke, carbon monoxide, proximity, temperature,time, physical orientation, acceleration, location, entry, presence,pressure, light, sound, and the like. A sensor also may be described interms of the particular physical device that obtains the environmentalinformation. For example, an accelerometer may obtain accelerationinformation, and thus may be used as a general motion sensor and/or anacceleration sensor. A sensor also may be described in terms of thespecific hardware components used to implement the sensor. For example,a temperature sensor may include a thermistor, thermocouple, resistancetemperature detector, integrated circuit temperature detector, orcombinations thereof. A sensor also may be described in terms of afunction or functions the sensor performs within an integrated sensornetwork, such as a smart home environment as disclosed herein. Forexample, a sensor may operate as a security sensor when it is used todetermine security events such as unauthorized entry. A sensor mayoperate with different functions at different times, such as where amotion sensor is used to control lighting in a smart home environmentwhen an authorized user is present, and is used to alert to unauthorizedor unexpected movement when no authorized user is present, or when analarm system is in an away (e.g., “armed”) state, or the like. In somecases, a sensor may operate as multiple sensor types sequentially orconcurrently, such as where a temperature sensor is used to detect achange in temperature, as well as the presence of a person or animal. Asensor also may operate in different modes at the same or differenttimes. For example, a sensor may be configured to operate in one modeduring the day and another mode at night. As another example, a sensormay operate in different modes based upon a state of a home securitysystem or a smart home environment, or as otherwise directed by such asystem.

In general, a “sensor” as disclosed herein may include multiple sensorsor sub-sensors, such as where a position sensor includes both a globalpositioning sensor (GPS) as well as a wireless network sensor, whichprovides data that can be correlated with known wireless networks toobtain location information. Multiple sensors may be arranged in asingle physical housing, such as where a single device includesmovement, temperature, magnetic, and/or other sensors. Such a housingalso may be referred to as a sensor, a sensor device, or a sensorpackage. For clarity, sensors are described with respect to theparticular functions they perform and/or the particular physicalhardware used, when such specification is necessary for understanding ofthe embodiments disclosed herein.

A sensor may include hardware in addition to the specific physicalsensor that obtains information about the environment. FIG. 12 shows anexample sensor as disclosed herein. The sensor 60 may include anenvironmental sensor 61, such as a temperature sensor, smoke sensor,carbon monoxide sensor, motion sensor, accelerometer, proximity sensor,passive infrared (PIR) sensor, magnetic field sensor, radio frequency(RF) sensor, light sensor, humidity sensor, pressure sensor, microphone,or any other suitable environmental sensor, that obtains a correspondingtype of information about the environment in which the sensor 60 islocated. A processor 64 may receive and analyze data obtained by thesensor 61, control operation of other components of the sensor 60, andprocess communication between the sensor and other devices. Theprocessor 64 may execute instructions stored on a computer-readablememory 65. The memory 65 or another memory in the sensor 60 may alsostore environmental data obtained by the sensor 61. A communicationinterface 63, such as a Wi-Fi or other wireless interface, Ethernet orother local network interface, or the like may allow for communicationby the sensor 60 with other devices. A user interface (UI) 62 mayprovide information and/or receive input from a user of the sensor. TheUI 62 may include, for example, a speaker to output an audible alarmwhen an event is detected by the sensor 60. Alternatively, or inaddition, the UI 62 may include a light to be activated when an event isdetected by the sensor 60. The user interface may be relatively minimal,such as a liquid crystal display (LCD), light-emitting diode (LED)display, or limited-output display, or it may be a full-featuredinterface such as a touchscreen. Components within the sensor 60 maytransmit and receive information to and from one another via an internalbus or other mechanism as will be readily understood by one of skill inthe art. One or more components may be implemented in a single physicalarrangement, such as where multiple components are implemented on asingle integrated circuit. Sensors as disclosed herein may include othercomponents, and/or may not include all of the illustrative componentsshown.

In some configurations, two or more sensors may generate data that canbe used by a processor of a system to generate a response and/or infer astate of the environment. For example, an ambient light sensor in a roommay determine that the room is dark (e.g., less than 601 ux). Amicrophone in the room may detect a sound above a set threshold, such as60 dB. The system processor may determine, based on the data generatedby both sensors that it should activate one or more lights in the room.In the event the processor only received data from the ambient lightsensor, the system may not have any basis to alter the state of thelighting in the room. Similarly, if the processor only received datafrom the microphone, the system may lack sufficient data to determinewhether activating the lights in the room is necessary, for example,during the day the room may already be bright or during the night thelights may already be on. As another example, two or more sensors maycommunicate with one another. Thus, data generated by multiple sensorssimultaneously or nearly simultaneously may be used to determine a stateof an environment and, based on the determined state, generate aresponse.

Data generated by one or more sensors may indicate a behavior pattern ofone or more users and/or an environment state over time, and thus may beused to “learn” such characteristics. For example, data generated by anambient light sensor in a room of a house and the time of day may bestored in a local or remote storage medium with the permission of an enduser. A processor in communication with the storage medium may compute abehavior based on the data generated by the light sensor. The lightsensor data may indicate that the amount of light detected increasesuntil an approximate time or time period, such as 3:30 PM, and thendeclines until another approximate time or time period, such as 5:30 PM,at which point there is an abrupt increase in the amount of lightdetected. In many cases, the amount of light detected after the secondtime period may be either below a dark level of light (e.g., under orequal to 601 ux) or bright (e.g., equal to or above 4001 ux). In thisexample, the data may indicate that after 5:30 PM, an occupant isturning on/off a light as the occupant of the room in which the sensoris located enters/leaves the room. At other times, the light sensor datamay indicate that no lights are turned on/off in the room. The system,therefore, may learn that occupants patterns of turning on and offlights, and may generate a response to the learned behavior. Forexample, at 5:30 PM, a smart home environment or other sensor networkmay automatically activate the lights in the room if it detects anoccupant in proximity to the home. In some embodiments, such behaviorpatterns may be verified using other sensors. Continuing the example,user behavior regarding specific lights may be verified and/or furtherrefined based upon states of, or data gathered by, smart switches,outlets, lamps, and the like.

Sensors as disclosed herein may operate within a communication network,such as a conventional wireless network, a mesh network (e.g., Thread),and/or a sensor-specific network through which sensors may communicatewith one another and/or with dedicated other devices. In someconfigurations, one or more sensors may provide information to one ormore other sensors, to a central controller, or to any other devicecapable of communicating on a network with the one or more sensors. Acentral controller may be general- or special-purpose. For example, onetype of central controller is a home automation network, that collectsand analyzes data from one or more sensors within the home. Anotherexample of a central controller is a special-purpose controller that isdedicated to a subset of functions, such as a security controller thatcollects and analyzes sensor data primarily or exclusively as it relatesto various security considerations for a location. A central controllermay be located locally with respect to the sensors with which itcommunicates and from which it obtains sensor data, such as in the casewhere it is positioned within a home that includes a home automationand/or sensor network. Alternatively or in addition, a centralcontroller as disclosed herein may be remote from the sensors, such aswhere the central controller is implemented as a cloud-based system thatcommunicates with multiple sensors, which may be located at multiplelocations and may be local or remote with respect to one another.

FIG. 13 shows an example of a sensor network as disclosed herein, whichmay be implemented over any suitable wired and/or wireless communicationnetworks. One or more sensors 71, 72 may communicate via a local network70, such as a Wi-Fi or other suitable network, with each other and/orwith a controller 73. The controller may be a general- orspecial-purpose computer such as a smartphone, a smartwatch, a tablet, alaptop, etc. The controller may, for example, receive, aggregate, and/oranalyze environmental information received from the sensors 71, 72. Thesensors 71, 72 and the controller 73 may be located locally to oneanother, such as within a single dwelling, office space, building, room,or the like, or they may be remote from each other, such as where thecontroller 73 is implemented in a remote system 74 such as a cloud-basedreporting and/or analysis system. In some configurations, the system mayhave multiple controllers 74 such as where multiple occupants'smartphones and/or smartwatches are authorized to control and/orsend/receive data to or from the various sensors 71, 72 deployed in thehome. Alternatively or in addition, sensors may communicate directlywith a remote system 74. The remote system 74 may, for example,aggregate data from multiple locations, provide instruction, softwareupdates, and/or aggregated data to a controller 73 and/or sensors 71,72.

The sensor network shown in FIG. 13 may be an example of a smart-homeenvironment. The depicted smart-home environment may include astructure, a house, office building, garage, mobile home, or the like.The devices of the smart home environment, such as the sensors 71, 72,the controller 73, and the network 70 may be integrated into asmart-home environment that does not include an entire structure, suchas an apartment, condominium, or office space.

The smart home environment can control and/or be coupled to devicesoutside of the structure. For example, one or more of the sensors 71, 72may be located outside the structure, for example, at one or moredistances from the structure (e.g., sensors 71, 72 may be disposedoutside the structure, at points along a land perimeter on which thestructure is located, and the like. One or more of the devices in thesmart home environment need not physically be within the structure. Forexample, the controller 73 which may receive input from the sensors 71,72 may be located outside of the structure.

The structure of the smart-home environment may include a plurality ofrooms, separated at least partly from each other via walls. The wallscan include interior walls or exterior walls. Each room can furtherinclude a floor and a ceiling. Devices of the smart-home environment,such as the sensors 71, 72, may be mounted on, integrated with and/orsupported by a wall, floor, or ceiling of the structure.

The smart-home environment including the sensor network shown in FIG. 13may include a plurality of devices, including intelligent,multi-sensing, network-connected devices, that can integrate seamlesslywith each other and/or with a central server or a cloud-computing system(e.g., controller 73 and/or remote system 74) to provide home-securityand smart-home features. The controller may determine an intensity levelof illumination for lights connected to the smart home system and/or acolor or temperature for the lights. The smart-home environment mayinclude one or more intelligent, multi-sensing, network-connectedthermostats (e.g., “smart thermostats”), one or more intelligent,network-connected, multi-sensing hazard detection units (e.g., “smarthazard detectors”), and one or more intelligent, multi-sensing,network-connected entryway interface devices (e.g., “smart doorbells”).The smart hazard detectors, smart thermostats, and smart doorbells maybe the sensors 71, 72 shown in FIG. 13 .

For example, a smart thermostat may detect ambient climatecharacteristics (e.g., temperature and/or humidity) and may control anHVAC (heating, ventilating, and air conditioning) system accordingly ofthe structure. For example, the ambient client characteristics may bedetected by sensors 71, 72 shown in FIG. 13 , and the controller 73 maycontrol the HVAC system (not shown) of the structure.

As another example, a smart hazard detector may detect the presence of ahazardous substance or a substance indicative of a hazardous substance(e.g., smoke, fire, or carbon monoxide). For example, smoke, fire,and/or carbon monoxide may be detected by sensors 71, 72 shown in FIG.13 , and the controller 73 may control an alarm system to provide avisual and/or audible alarm to the user of the smart-home environment.

As another example, a smart doorbell may control doorbell functionality,detect a person's approach to or departure from a location (e.g., anouter door to the structure), and announce a person's approach ordeparture from the structure via audible and/or visual message that isoutput by a speaker and/or a display coupled to, for example, thecontroller 73.

In some embodiments, the smart-home environment of the sensor networkshown in FIG. 13 may include one or more intelligent, multi-sensing,network-connected wall switches (e.g., “smart wall switches”), one ormore intelligent, multi-sensing, network-connected wall plug interfaces(e.g., “smart wall plugs”). The smart wall switches and/or smart wallplugs may be or include one or more of the sensors 71, 72 shown in FIG.13 . A smart wall switch may detect ambient lighting conditions, andcontrol a power and/or dim state of one or more lights. For example, asensor such as sensors 71, 72, may detect ambient lighting conditions,and a device such as the controller 73 may control the power to one ormore lights (not shown) in the smart-home environment. Smart wallswitches may also control a power state or speed of a fan, such as aceiling fan. For example, sensors 72, 72 may detect the power and/orspeed of a fan, and the controller 73 may adjust the power and/or speedof the fan, accordingly. Smart wall plugs may control supply of power toone or more wall plugs (e.g., such that power is not supplied to theplug if nobody is detected to be within the smart-home environment). Forexample, one of the smart wall plugs may control supply of power to alamp (not shown).

In embodiments of the disclosed subject matter, a smart-home environmentmay include one or more intelligent, multi-sensing, network-connectedentry detectors (e.g., “smart entry detectors”). Such detectors may beor include one or more of the sensors 71, 72 shown in FIG. 13 . Theillustrated smart entry detectors (e.g., sensors 71, 72) may be disposedat one or more windows, doors, and other entry points of the smart-homeenvironment for detecting when a window, door, or other entry point isopened, broken, breached, and/or compromised. The smart entry detectorsmay generate a corresponding signal to be provided to the controller 73and/or the remote system 74 when a window or door is opened, closed,breached, and/or compromised. In some embodiments of the disclosedsubject matter, the alarm system, which may be included with controller73 and/or coupled to the network 70 may not be placed in an away mode(e.g., “armed”) unless all smart entry detectors (e.g., sensors 71, 72)indicate that all doors, windows, entryways, and the like are closedand/or that all smart entry detectors are in an away mode. In someconfigurations, the system may arm if it can be determined that thedistance the door (or window) is ajar is insubstantial (e.g., theopening is not wide enough for a person to fit through).

The smart-home environment of the sensor network shown in FIG. 13 caninclude one or more intelligent, multi-sensing, network-connecteddoorknobs (e.g., “smart doorknob”). For example, the sensors 71, 72 maybe coupled to a doorknob of a door (e.g., doorknobs 122 located onexternal doors of the structure of the smart-home environment). However,it should be appreciated that smart doorknobs can be provided onexternal and/or internal doors of the smart-home environment.

The smart thermostats, the smart hazard detectors, the smart doorbells,the smart wall switches, the smart wall plugs, the smart entrydetectors, the smart doorknobs, the keypads, and other devices of asmart-home environment (e.g., as illustrated as sensors 71, 72 of FIG.13 ) can be communicatively coupled to each other via the network 70,and to the controller 73 and/or remote system 74 to provide security,safety, and/or comfort for the smart home environment.

A user can interact with one or more of the network-connected smartdevices (e.g., via the network 70). For example, a user can communicatewith one or more of the network-connected smart devices using a computer(e.g., a desktop computer, laptop computer, tablet, or the like) orother portable electronic device (e.g., a smartphone, a tablet, a keyFOB, or the like). A webpage or application can be configured to receivecommunications from the user and control the one or more of thenetwork-connected smart devices based on the communications and/or topresent information about the device's operation to the user. Forexample, the user can view or change the mode of the security system ofthe home.

One or more users can control one or more of the network-connected smartdevices in the smart-home environment using a network-connected computeror portable electronic device. In some examples, some or all of theusers (e.g., individuals who live in the home) can register their mobiledevice and/or key FOBs with the smart-home environment (e.g., with thecontroller 73). Such registration can be made at a central server (e.g.,the controller 73 and/or the remote system 74) to authenticate the userand/or the electronic device as being associated with the smart-homeenvironment, and to provide permission to the user to use the electronicdevice to control the network-connected smart devices and the securitysystem of the smart-home environment. A user can use their registeredelectronic device to remotely control the network-connected smartdevices and security system of the smart-home environment, such as whenthe occupant is at work or on vacation. The user may also use theirregistered electronic device to control the network-connected smartdevices when the user is located inside the smart-home environment.

Alternatively, or in addition to registering electronic devices, thesmart-home environment may make inferences about which individuals livein the home and are therefore users and which electronic devices areassociated with those individuals. As such, the smart-home environmentmay “learn” who is a user (e.g., an authorized user) and permit theelectronic devices associated with those individuals to control thenetwork-connected smart devices of the smart-home environment (e.g.,devices communicatively coupled to the network 70), in some embodimentsincluding sensors used by or within the smart-home environment. Varioustypes of notices and other information may be provided to users viamessages sent to one or more user electronic devices. For example, themessages can be sent via email, short message service (SMS), multimediamessaging service (MMS), unstructured supplementary service data (USSD),as well as any other type of messaging services and/or communicationprotocols.

A smart-home environment may include communication with devices outsideof the smart-home environment but within a proximate geographical rangeof the home. For example, the smart-home environment may include anoutdoor lighting system (not shown) that communicates informationthrough the communication network 70 or directly to a central server orcloud-computing system (e.g., controller 73 and/or remote system 74)regarding detected movement and/or presence of people, animals, and anyother objects and receives back commands for controlling the lightingaccordingly.

The controller 73 and/or remote system 74 can control the outdoorlighting system based on information received from the othernetwork-connected smart devices in the smart-home environment. Forexample, in the event that any of the network-connected smart devices,such as smart wall plugs located outdoors, detect movement at nighttime,the controller 73 and/or remote system 74 can activate the outdoorlighting system and/or other lights in the smart-home environment.

In some configurations, a remote system 74 may aggregate data frommultiple locations, such as multiple buildings, multi-residentbuildings, and individual residences within a neighborhood, multipleneighborhoods, and the like. In general, multiple sensor/controllersystems 81, 82 as previously described with respect to FIG. 13 mayprovide information to the remote system 74 as shown in FIG. 14 . Thesystems 81, 82 may provide data directly from one or more sensors aspreviously described, or the data may be aggregated and/or analyzed bylocal controllers such as the controller 73, which then communicateswith the remote system 74. The remote system may aggregate and analyzethe data from multiple locations, and may provide aggregate results toeach location. For example, the remote system 74 may examine largerregions for common sensor data or trends in sensor data, and provideinformation on the identified commonality or environmental data trendsto each local system 81, 82.

In situations in which the systems discussed here collect personalinformation about users, or may make use of personal information, theusers may be provided with an opportunity to control whether programs orfeatures collect user information (e.g., information about a user'ssocial network, social actions or activities, profession, a user'spreferences, or a user's current location), or to control whether and/orhow to receive content from the content server that may be more relevantto the user. In addition, certain data may be treated in one or moreways before it is stored or used, so that personally identifiableinformation is removed. As another example, systems disclosed herein mayallow a user to restrict the information collected by the systemsdisclosed herein to applications specific to the user, such as bydisabling or limiting the extent to which such information is aggregatedor used in analysis with other information from other users. Thus, theuser may have control over how information is collected about the userand used by a system as disclosed herein.

Implementations of the presently disclosed subject matter may beimplemented in and used with a variety of component and networkarchitectures. FIG. 15 is an example computer 20 suitable forimplementations of the presently disclosed subject matter. The computer20 includes a bus 21 which interconnects major components of thecomputer 20, such as a central processor 24, a memory 27 (typically RAM,but which may also include ROM, flash RAM, or the like), an input/outputcontroller 28, a user display 22, such as a display screen via a displayadapter, a user input interface 26, which may include one or morecontrollers and associated user input devices such as a keyboard, mouse,and the like, and may be closely coupled to the I/O controller 28, fixedstorage 23, such as a hard drive, flash storage, Fibre Channel network,SAN device, SCSI device, and the like, and a removable media component25 operative to control and receive an optical disk, flash drive, andthe like.

The bus 21 allows data communication between the central processor 24and the memory 27, which may include read-only memory (ROM) or flashmemory (neither shown), and random access memory (RAM) (not shown), aspreviously noted. The RAM is generally the main memory into which theoperating system and application programs are loaded. The ROM or flashmemory can contain, among other code, the Basic Input-Output system(BIOS) which controls basic hardware operation such as the interactionwith peripheral components. Applications resident with the computer 20are generally stored on and accessed via a computer readable medium,such as a hard disk drive (e.g., fixed storage 23), an optical drive,floppy disk, or other storage medium 25.

The fixed storage 23 may be integral with the computer 20 or may beseparate and accessed through other interfaces. A network interface 29may provide a direct connection to a remote server via a telephone link,to the Internet via an internet service provider (ISP), or a directconnection to a remote server via a direct network link to the Internetvia a POP (point of presence) or other technique. The network interface29 may provide such connection using wireless techniques, includingdigital cellular telephone connection, Cellular Digital Packet Data(CDPD) connection, digital satellite data connection, or the like. Forexample, the network interface 29 may allow the computer to communicatewith other computers via one or more local, wide-area, or othernetworks, as shown in FIG. 16 .

Many other devices or components (not shown) may be connected in asimilar manner (e.g., document scanners, digital cameras, and so on).Conversely, all of the components shown in FIG. 15 need not be presentto practice the present disclosure. The components can be interconnectedin different ways from that shown. The operation of a computer such asthat shown in FIG. 15 is readily known in the art and is not discussedin detail in this application. Code to implement the present disclosurecan be stored in computer-readable storage media such as one or more ofthe memory 27, fixed storage 23, removable media 25, or on a remotestorage location.

FIG. 16 shows an example network arrangement according to animplementation of the disclosed subject matter. One or more clients 10,11, such as local computers, smart phones, tablet computing devices, andthe like may connect to other devices via one or more networks 7. Thenetwork may be a local network, wide-area network, the Internet, or anyother suitable communication network or networks, and may be implementedon any suitable platform including wired and/or wireless networks. Theclients may communicate with one or more servers 13 and/or databases 15.The devices may be directly accessible by the clients 10, 11, or one ormore other devices may provide intermediary access such as where aserver 13 provides access to resources stored in a database 15. Theclients 10, 11 also may access remote platforms 17 or services providedby remote platforms 17 such as cloud computing arrangements andservices. The remote platform 17 may include one or more servers 13and/or databases 15.

More generally, various implementations of the presently disclosedsubject matter may include or be implemented in the form ofcomputer-implemented processes and apparatuses for practicing thoseprocesses. The disclosed subject matter also may be implemented in theform of a computer program product having computer program codecontaining instructions implemented in non-transitory and/or tangiblemedia, such as floppy diskettes, CD-ROMs, hard drives, USB (universalserial bus) drives, or any other machine readable storage medium,wherein, when the computer program code is loaded into and executed by acomputer, the computer becomes an apparatus for practicingimplementations of the disclosed subject matter. Implementations alsomay be implemented in the form of computer program code, for example,whether stored in a storage medium, loaded into and/or executed by acomputer, or transmitted over some transmission medium, such as overelectrical wiring or cabling, through fiber optics, or viaelectromagnetic radiation, wherein when the computer program code isloaded into and executed by a computer, the computer becomes anapparatus for practicing implementations of the disclosed subjectmatter. When implemented on a general-purpose microprocessor, thecomputer program code segments configure the microprocessor to createspecific logic circuits. In some configurations, a set ofcomputer-readable instructions stored on a computer-readable storagemedium may be implemented by a general-purpose processor, which maytransform the general-purpose processor or a device containing thegeneral-purpose processor into a special-purpose device configured toimplement or carry out the instructions.

Implementations may use hardware that includes a processor, such as ageneral-purpose microprocessor and/or an Application Specific IntegratedCircuit (ASIC) that embodies all or part of the techniques according toembodiments of the disclosed subject matter in hardware and/or firmware.The processor may be coupled to memory, such as RAM, ROM, flash memory,a hard disk or any other device capable of storing electronicinformation. The memory may store instructions adapted to be executed bythe processor to perform the techniques according to embodiments of thedisclosed subject matter.

The foregoing description, for purpose of explanation, has beendescribed with reference to specific implementations. However, theillustrative discussions above are not intended to be exhaustive or tolimit implementations of the disclosed subject matter to the preciseforms disclosed. Many modifications and variations are possible in viewof the above teachings. The implementations were chosen and described inorder to explain the principles of implementations of the disclosedsubject matter and their practical applications, to thereby enableothers skilled in the art to utilize those implementations as well asvarious implementations with various modifications as may be suited tothe particular use contemplated.

1. (canceled)
 2. An apparatus comprising: a housing comprising a batterycompartment and a retention part for retaining a battery in the batterycompartment; a sensor disposed in the housing; and a backplatecomprising at least one slot for attachment to a snap of a magazinedisposed in the housing.
 3. The apparatus of claim 2, furthercomprising: a lens inserted into an opening of the housing.
 4. Theapparatus of claim 3, further comprising: a mask covering a portion ofan interior of the lens.
 5. The apparatus of claim 4, wherein the sensoris positioned underneath the lens and the mask.
 6. The apparatus ofclaim 5, further comprising: a light pipe around the sensor, the lens,and the mask.
 7. The apparatus of claim 6, wherein a light emittingdiode is disposed within the housing below the light pipe.
 8. Theapparatus of claim 2, wherein the sensor comprises a passive infraredsensor.
 9. The apparatus of claim 2, wherein the sensor comprises anambient light sensor.
 10. The apparatus of claim 2, wherein the sensorcomprises a temperature and humidity sensor.
 11. The apparatus of claim2, wherein the retention part comprises a U-shaped structure and twoprongs at ends of the U-shaped structure.
 12. The apparatus of claim 2,further comprising: a tamper switch, the tamper switch comprising a cap,a frame placed around the cap, a plunger, and a detect switch.
 13. Theapparatus of claim 12, wherein the cap protrudes through an opening inthe frame and is positioned to push down the plunger that is positionedto push down the detect switch when pressed against a surface andrelease the plunger which releases the detect switch when not pressedagainst a surface.
 14. The apparatus of claim 2, further comprising: anairflow gasket around the sensor.
 15. The apparatus of claim 2, furthercomprising: a sled disposed inside the housing.
 16. The apparatus ofclaim 15, further comprising: at least one circuit board attached to thesled and connected to one or more leads of the sensor.
 17. The apparatusof claim 2, wherein an adhesive strip is attached to a back of thebackplate and a pull tab of the adhesive strip is pulled through a slotof the backplate to a front of the backplate.
 18. The apparatus of claim2, wherein the backplate comprises a slot and crush ribs for a bubblelevel, wherein the bubble level is disposed in between crush ribs at alocation of the slot.
 19. The apparatus of claim 2, further comprising:a sleeve, the sleeve covering the housing, the sleeve further comprisinga screw hole.